TSMC Chairman Mark Liu Reaffirms Global Expansion Strategy; Semiconductor Equipment and Engineering Firms Expected to See Strong Momentum in 2026

On October 16, TSMC Chairman Mark Liu once again emphasized that the company’s global operational layout continues to progress steadily. The market is optimistic that the semiconductor supply chain—especially equipment and engineering service providers—will experience robust business opportunities in 2026. Institutional investors pointed out that the main beneficiaries include engineering and equipment firms such as Hantang, Fansheng (Topco Scientific), Sunengine (CCM), Ruize, Gudeng, Grand Process, and Marketech, all of which are expected to enjoy substantial business growth in 2026.

TSMC is accelerating its worldwide expansion, with new fab construction and capacity expansion projects across the United States, Japan, Europe, and Taiwan. The new plant in Arizona, USA, is advancing rapidly, with plans to upgrade more quickly to the N2 and N2+ process nodes to meet diverse demand in smartphones, AI, and high-performance computing (HPC) applications. In Japan’s Kumamoto, Fab 1 began mass production in 2024, while Fab 2 has already broken ground. The construction schedule will be adjusted according to customer needs and market conditions. In Dresden, Germany, fab construction has begun with strong support from the EU and German governments, marking TSMC’s first special-process wafer fab in Europe. It is expected to gradually enter mass production after 2026.

Domestic Expansion: Taiwan’s “Dual-Axis” Growth Strategy

In addition to overseas expansion, TSMC is also expanding its three major production bases in Taiwan — Hsinchu Baoshan, Kaohsiung, and Chiayi, forming a “dual-axis” growth strategy combining domestic and global expansion.

• The Baoshan plant is tasked with mass-producing 2-nanometer generation chips.

• The Kaohsiung facility will introduce advanced packaging and select advanced process capacity.

• The Chiayi site will extend advanced packaging and testing lines, strengthening the depth of the semiconductor supply chain in southern Taiwan.

Market Outlook and Beneficiary Analysis

Market analysts believe that this wave of comprehensive expansion will trigger a surge in engineering construction, equipment installation, and cleanroom validation demand between 2025 and 2026, driving a new wave of orders throughout the related equipment supply chain.

According to institutional analysis:

• Hantang, Fansheng, and Sunengine are TSMC’s key construction partners, mainly responsible for cleanroom, electromechanical, and facility system engineering. These companies have also expanded overseas and are expected to share in the business opportunities from TSMC’s Arizona, Kumamoto, and Dresden fabs.

• Ruize (Raytek), leveraging its expertise in dust control and process gas treatment equipment, has been increasing its market share in the Sub-Fab (facility system layer) segment of the semiconductor industry.